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Materials

Photosensitive materials for microstructures and thick layers

A new range of materials

The Dilase technology developed and patented by Kloé is based on its experience in photolithography as well as on its know-how in the development of organic-inorganic hybrid materials by sol-gel process.
Therefore, we have at our disposal an excellent knowledge and comprehension of phenomenons involved in the interactions of photon with matter. 
Kloé offers a large brand of adhesivescoatings and resists having recognised thermal, mecanic and optical properties.

A NEW RANGE OF PHOTOSENSITIVE MATERIALS

OUR MATERIALS OFFER

The synthesis and elaboration of new materials are part of Kloé's core business, which has already developped about thirty formulas. These materials are meant for applications of optical assembling, antiscratch coatings, hydrophobics, lipophylics, anti-reflectives, thin or thick photoresists and grayscale resists.

 K-PX ADHESIVES

K-PX ADHESIVES

The K-Px adhesive range developed and patented by Kloé is synthesized with organomineral precursors. The final compound is a hybrid structure made up of two interleaved networks, one organic, the other inorganic. These solutions exhibit quite a few recognised physical and chemical properties such as low ETC/TEC, a low shrinkage, a high mechanical resistance to chemical agents and a good aging stability. The mechanical strengh and aging stability comes from the mineral network whereas the compliance and the photosensitivity come from the organic network.

K-Px ADHESIVES SPECIFICATIONS

The adhesives from the range K-PX can be activated either thermically or by UV exposure. The good mechanical strengh and aging stability come from the mineral network whereas the compliance and photosensitivity  comes from the organic network.

K-PT : Colle à réticulation thermique

K-PT: thermal cross-linking adhesive

K-PU : Colle UV à faible CTE

K-PU: low ETC/TEC UV curable adhesive

K-PUt: High thermal resistance adhesive

K-PUt: High thermal resistance adhesive

K-PUm : Colle UV pour pigtailing optique

K-PUm: UV adhesive for optical pigtailling / assembling

K-Px ADHESIVES APPLICATIONS  

Those adhesives are all ready qualified for many applications such as optical assembling for space industry, interconnects and cryogenic applications.

 LES RESINES DE PHOTOLITHOGRAPHIE : K-CL

PHOTORESISTS : K-CL 

Kloe also developed K-CL, its own range of negative tone photoresists for photolithography, based on hybrid organic-inorganic materials.  The presence of a mineral network in the formulations provides these photoresists some specific mechanical properties after polymerization, such as a strong resistance to wet etching processes (semiconductors), and to dry etching processes such as RIE, DRIE and plasma etching. These photoresist are also compatible with high aspect ratios (1x50) due to their excellent mechanical characteristics. Having a large range available, K-CL photoresist offer an operating range at wavelengths between 325 and 425 nm, over thick and thin layers, deposited by spin coating, dip-coating, spray-coating, doctorblade ..

K-CL SPECIFICATIONS

  • Hybrid sol-gel composition : methacrylate based materials
  • Viscosity: between 10 and 150 cP at 20°C   
  • Coating thickness : between 500nm and 150µm
  • Aspect ratio: up to 1x50
  • Polymerization wavelength: from 325 to 405 nm
  • Refractive index (at 633 nm) : between 1.525 and 1.5401
  • Thermal resistance: 120°C 
  • Mechanical resistance: RIE, DRIE, Plasma compatible
  • Development: alcoholic solution

K-CL PHOTORESIST APPLICATIONS

The K-CL photoresist qualified biocompatible, are perfectly adapted to microfluidic reactors fabrication. Their mechanical resistance are brought into play for high aspect ratio structures fabrication. Their low roughness makes them compatible with PDMS moldings fabrication. Finally, K-CL is also an excellent masking solution for silicon deep etching by DRIE.

 LES RESINES DE PHOTOLITHOGRAPHIE : K-CL

GRAYSCALE RESISTS : K-NG

The K-NG resist are synthesized via a sol-gel process using organo-mineral precursors.  The precurors choice enables to obtain a material with high optical transparency once polymerized. The implemented specific synthesis lead to benefit from an exposure threshold close to 0 essential to the realization of fine grayscale levels microstructures. Once exposed and chemically revealed, the surface roughness comes to around few nanometers for microstructures whose thickness is set between tens of nanometers and several tens of microns.

K-NG SPECIFICATIONS

  • Hybrid sol-gel composition : methacrylate based materials
  • Viscosity: between 10 and 150 cP at 20°C
  • Coating thickness : between 100nm and 100µm
  • Applications : Microlenses - blazed gratings networks...
  • Polymerization wavelength: from 325 to 405 nm
  • Refractive index (at 633 nm) : 1.555
  • Thermal resistance: 120°C 
  • Mechanical resistance: RIE, DRIE, Plasma compatible...
  • Revealing agent: alcoholic solution

K-NG RESIST APLLICATIONS

Thanks to their good optical transparency in the visible and the NIR, the K-NG resists are an excellent solution for the fabrication of cylindric or spherical microlenses, single or in matrix arranged, and for high efficiency diffractive gratings. K-NG is also usable as a sacrificial grayscale lithographic layer.