What is the operating principle of the Dilase 3D?
The Dilase 3D is a high resolution 3D printing system, with a 2µm resolution.
This equipment uses a UV laser beam (375nm or 405nm) to polymerize a UV photosensitive resin, allowing to print 3D objects, from STL files.
The object to be produced must therefore be sliced in order to be able to write the successive layers.
The thickness between the slices is called Slicing pitch. This thickness, adjustable by the user, can be defined between a few microns and several hundred microns depending on the optical treatment chosen and the resolution needed.
The slicing pitch will allow to adjust the resolution in Z.
Each of the slices can be written according to three writing strategies:
- Filling: the fillings will make it possible to cover large areas using high linear movement speeds.
- Filling + contour: it enables to cover large areas, quickly, and to obtain smooth edges, thanks to the true vectorial writing mode.
- Contour: the contours will allow to smooth the edges of the slices, allowing to have straight sides, using slower writing speed.
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Field of application