High resolution 3D micro-printing: Dilase 3D
3D tabletop micro stereolithography system
High resolution 3D lithographic laser system, the Dilase 3D offers the possibility to work in 3 dimensions with a resolution of 5µm standard (until 2µm optional). It allows to write on all type of substrate (semi-conductor, glass, polymer, cristal, thin film…) on a surface expendable up to 100 x 100mm, and a depth of 50mm.
A novel technology
High resolution objects with a great volume
Kloe has developped a new approach in 3D printing through its knowledge in laser photolithography. Kloe offers a high resolution 3D printing tool (<5µm) currently unique on the market. Dilase 3D enables to conceive high resolution objects with a great volume (100 x 100 x 50mm³).
Partnership LAAS-CNRS / Kloé
High resolution 3D printer
Great depth of focus
The large depth of focus resulting from the specific optical processing developed by Kloe, allows to write as easily in thick layers as thinner layers with the same verticality of edges and minimal roughness.
Therefore, one can save a lot of time in the work process of large object without a quality loss.
Specific softwares for 3D printing
The software suite Dilasesoft and 3DSlicer equips in standard all 3D equipment.
Perfectly adapted, this software suite brings you concrete answers to current demand in microfabrication, from the prototype phase to the full production.
3DSlicer to visualize and convert your 3D design files to be compatible with our equipment
It enables not only the importation of STL files which is the standard format in 3D industry, but also to recreate a 3D design with the assistance of monochrome images.
DilaseSoft to manage the high resolution 3D printer Dilase 3D
Developed to pilot the lithographic equipment of Dilase range, DilaseSoft is a piloting software that ensures the production of all type of design written by direct laser.
- Linear writing speed: up to 100mm/s
- Address grid: 100nm
- Repeatability: 100nm
- Sample holder: 25 x 25mm², 50 x 50mm², 100 x 100mm²
- Planar substrates: up to 100 x 100mm
- Laser beam width combination available: 2µm with 10µm, 5µm with 20µm, 10µm with 60µm
- Dimensions: 544 x 703 x 865mm
- Available laser sources: 375nm or 405nm
- Accepted files format: STL
- Motorized focal length
- Integrated design software: 3D Slicer and Dilasesoft
- Two writing modes: vectorial and scanning